Wafer Grinding

Wafer Grinding and Polishing. Wafer Pick and Place. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of RD. Wafer Grinding and Polishing.

OVERVIEW

The web site wafergrind.com presently has a traffic classification of zero (the lower the more users). We have parsed ten pages inside the web site wafergrind.com and found nine websites referring to wafergrind.com. We were able to find two contacts and directions for wafergrind.com to help you communicate with them. The web site wafergrind.com has been online for one thousand four hundred and fifty weeks, twenty days, twenty-two hours, and eleven minutes.
Pages Parsed
10
Links to this site
9
Contacts
2
Addresses
2
Online Since
Sep 1997

WAFERGRIND.COM TRAFFIC

The web site wafergrind.com is seeing fluctuating quantities of traffic until the end of the year.
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WAFERGRIND.COM HISTORY

The web site wafergrind.com was first submitted to the registrar on September 12, 1997. This web page was updated on the date of July 13, 2014. This web site will expire on the date of September 11, 2015. It is currently one thousand four hundred and fifty weeks, twenty days, twenty-two hours, and eleven minutes old.
REGISTERED
September
1997
UPDATED
July
2014
EXPIRED
September
2015

WEB PAGE MATURITY

27
YEARS
9
MONTHS
21
DAYS

LINKS TO WAFERGRIND.COM

IWLPC - International Wafer Level Packaging Conference

IWLPC brings together the semiconductor industrys most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging. October 23 - 25, 2018. DoubleTree by Hilton San Jose. San Jose, California, USA. October 23 - 25, 2018. DoubleTree by Hilton San Jose. San Jose, California, USA. Submit an abstract for IWLPC 2018! Click here to submit an abstract! Best Presentation and Papers Awards Announced. The IWLPC Technical Committee i.

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And our 2017 TGS worldwide events.

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TestEdge - Your IC Test Engineering Partner with Solutions For All Your Semiconductor Test Needs

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Welcome to UHV Sputtering Inc.

Specializes in custom thin film coatings, bonding services and offers target materials. continuously strengthens its service to provide diversity in its products and for future product expansion. Our mission is to provide the highest quality workmanship, products and materials at a fast delivery and competitive prices.

WHAT DOES WAFERGRIND.COM LOOK LIKE?

Desktop Screenshot of wafergrind.com Mobile Screenshot of wafergrind.com Tablet Screenshot of wafergrind.com

CONTACTS

Grinding And Dicing Services Inc.

925 Berryessa Rd

San Jose, CA, 95133

US

Grinding And Dicing Services Inc.

Grinding And Dicing Services Inc.

925 Berryessa Rd

San Jose, CA, 95133

US

WAFERGRIND.COM SERVER

Our crawlers found that the main root page on wafergrind.com took eighty-four milliseconds to load. Our web crawlers could not discover a SSL certificate, so therefore our parsers consider wafergrind.com not secure.
Load time
0.084 sec
SSL
NOT SECURE
IP
206.188.193.203

NAME SERVERS

ns10.worldnic.com
ns9.worldnic.com

SERVER SOFTWARE AND ENCODING

We revealed that wafergrind.com is weilding the Apache/2.2.29 (Unix) FrontPage/5.0.2.2635 os.

SITE TITLE

Wafer Grinding

DESCRIPTION

Wafer Grinding and Polishing. Wafer Pick and Place. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of RD. Wafer Grinding and Polishing.

PARSED CONTENT

The web site had the following in the web site, "Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics." I noticed that the web site stated " To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield." They also said " GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of RD."

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